Hardware: Difference between revisions
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This page lists and describes the hardware found inside the Nintendo 3DS. Many of these parts are proprietary and are expanded upon here or in other pages. | |||
== Specifications == | == Specifications == | ||
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== FCRAM == | == FCRAM == | ||
There is one FCRAM(Fast Cycle RAM) in the 3DS. | There is one FCRAM (Fast Cycle RAM) IC in the 3DS, produced by Fujitsu and branded as MB82M8080-07L. The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645. | ||
The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645. The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format. | The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format. The MB81EDS516545 is suited for consumer applications requiring high data bandwidth with low power consumption. | ||
MB81EDS516545 is suited for consumer | |||
== Images == | == Images == | ||