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Line 1: + + + + + + + + + + + + + + + + + + + + + + + + + + − + − |- − | SoC || Nintendo 1048 0H (Custom): CPU, GPU, VRAM & DSP all on one chip. || N/A || N/A − |- − | ARM11 Processor Core || ARM11 MPCore 2x 268MHz(~268123480 Hz) & 2x VFPv2 Co-Processor || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html] || [11] − + + + + + − + − + − + − + + − + − + − + − + − + − + − + − + + Line 47:
Line 75: − == [[New_3DS]] Specifications ==+ − {| class="wikitable" − ! Type !! Description !! Datasheet !! Source − |- − | ARM11 Processor Core || ARM11 MPCore 4x 268MHz(~268123480 Hz) & 4x VFPv2 Co-Processor || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html] || N/A − |- − | ARM9 Processor Core || ARM946 134MHz(~134058675 Hz) || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0201d/index.html] || N/A − |- − | FCRAM || 256MB || N/A || N/A − |- − | Storage || Samsung KLM4G1YEQC 2GB NAND Flash || N/A || N/A − |- − | VRAM || 6 MB within SoC. Independent of system memory (FCRAM). || N/A || N/A − |- − | || 4MB of additional memory inside SoC. || N/A || N/A − |- − | Power Management || Texas Instruments AIC3010B 39C4ETW || N/A || N/A − |- − | Auxiliary Microcontroller || Renesas Electronics UC KTR, custom Nintendo microcontroller || N/A || N/A − |- − | ? || "TI 93045A4 38A6TYW G2" || N/A || N/A − |- − | [[NFC Services|NFC]] || || N/A || N/A − |- − | [[MVD Services|MVD]] || Hardware video decoder (it's unknown whether this can do more than decoding). || N/A || N/A − |- − | [[IR_Services|New HID]] || C-Stick and ZL+ZR buttons. This new HID is usable for software which uses [[Circle Pad Pro]], see [[IR_Services|here]]. || N/A || N/A − |} − − Note that 4 cores is also the maximum number of cores available with [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html ARM11-MPCore]. Line 94:
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no edit summary
This page lists and describes the hardware found inside the Nintendo 3DS. Many of these parts are custom made and are expanded upon here or in other pages.
This page lists and describes the hardware found inside the Nintendo 3DS. Many of these parts are custom made and are expanded upon here or in other pages.
== Common hardware ==
{| class="wikitable"
! Type !! Description
|-
| ARM11 Processor Core || Old3DS: [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html ARM11 2x MPCore & 2x VFPv2 Co-Processor] 268MHz(~268111855.956 Hz).
New3DS: 4x MPCore, 4x VFPv2, able to run up to 804MHz (see below). It also has an optional 2MB L2 cache.
|-
| ARM9 Processor Core || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0201d/index.html ARM946] 134MHz(~134055927.861 Hz),
|-
| GPU || [http://en.wikipedia.org/wiki/PICA200 DMP PICA] 268MHz,
|-
| VRAM || 6 MB within SoC.
|-
| Top screen || 800x240, with only 400 usable pixels per eye per line.
|-
| Bottom screen || 320x240, with resistive touch overlay.
|-
| DSP || [https://twitter.com/CEVADSP/status/177172880918986752 CEVA TeakLite]. 134Mhz. 24ch 32728Hz sampling rates.
|}
New3DS exclusives are able to clock the CPU at 804MHz, but this appears to be limited to the currently running application/app cores. Timed by running svcGetSystemTick on either side of a long idle loop to stay in the current process context. svcGetSystemTick uses a tick counter running at 268MHz in this mode.
On New3DS: when Home Menu is active, the system runs at 804MHz. For everything else, it's 268MHz, except when the app(let) has the required flag set. See [[NCCH/Extended_Header|here]] and [[PDN_Registers|here]] for details, regarding clock-rate and cache.
For New3DS-only there are multiple clock-rate multiplier values available in [[PDN_Registers|hardware]], but since the relevant code is only implemented in the New3DS ARM11-kernel, the only non-normal clock-rate available with official kernel code is 3x.
== Specifications ==
== Specifications ==
{| class="wikitable"
{| class="wikitable"
! Type !! Name !! Datasheet !! Source
! Type !! 3DS !! 3DSXL !! 2DS !! N3DS !! N3DSXL
|-
|-
| ARM9 Processor Core || ARM946 134MHz(~134058675 Hz) || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0201d/index.html] || N/A
| SoC || CPU CTR (1048 0H)
CPU CTR (1214 32)
|| CPU CTR A (1226 60)
CPU CTR (1037 21)
|| CPU CTR B (??) || CPU LGR A (1444 86) || CPU LGR A (1446 17)
|-
|-
| GPU || [http://en.wikipedia.org/wiki/PICA200 DMP PICA] 268MHz || N/A || [11]
| FCRAM || [http://www.fujitsu.com/downloads/MICRO/fma/pdf/MB81EDS516545_e511463.pdf 2x64MB Fujitsu MB82M8080-07L] || Fujitsu MB82DBS16641 || Fujitsu MB82DBS1664 || ?? || Fujitsu MB82MK9A9A
|-
|-
| DSP || CEVA TeakLite. Based on Atmel AT75C. 134Mhz. 24ch 32728Hz sampling rates. || N/A || [11] [https://twitter.com/CEVADSP/status/177172880918986752]
| Top Screen || 3.53 in, 3D || 4.88 in, 3D || 3.53 in(?) cropped from a single panel || 3.88 in, 3D || 4.88 in, 3D
|-
|-
| VRAM || 6 MB within SoC. Independent of system memory (FCRAM). || N/A || [11]
| Bottom Screen || 3.00 in || 4.18 in || 3.00 in(?) cropped from a single panel || 3.33 in || 4.18 in
|-
|-
| FCRAM || 2x64MB Fujitsu MB82M8080-07L ||[http://crediar.no-ip.com/sg_/download.php?id=d67d1c][http://edevice.fujitsu.com/fj/DATASHEET/e-ds/e511463.pdf][http://edevice.fujitsu.com/jp/datasheet/j-ds/j511463.pdf]|| [5]
| Storage ||colspan="3"| Toshiba THGBM2G3P1FBAI8 1GB ||colspan="2"| Samsung KLM4G1YEQC 4GB (in 1.3GiB SLC mode)
Toshiba THGBMBG4P1KBAIT 2GB (MLC, approx. 1.8GiB usable)
|-
|-
| Storage || Toshiba THGBM2G3P1FBAI8 1GB NAND Flash || N/A || N/A
| Speaker, Microphone, Circlepad, Touch controller || TI PAIC3010B 0AA37DW || ?? || ?? || TI AIC3010B 39C4ETW || TI AIC3010D 48C01JW
|-
|-
| Power Management || Texas Instruments PAIC3010B 0AA37DW || N/A || FCC filing
| Gyroscope || [http://dl-web.dropbox.com/u/20520664/references/PS-ITG-3200-00-01.4.pdf Invensense ITG-3270 MEMS Gyroscope] || ?? || ?? || ?? || ??
|-
|-
| Gyroscope || Invensense ITG-3270 MEMS Gyroscope || [http://dl-web.dropbox.com/u/20520664/references/PS-ITG-3200-00-01.4.pdf] || N/A
| Accelerometer || ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH || ?? || ?? || ?? || ??
|-
|-
| Accelerometer || ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH || [http://dl.dropbox.com/u/20520664/references/CD00213470.pdf] || N/A
| Wifi || Atheros AR6014 || ?? || ?? || ?? || Atheros AR6014G-AL1C
|-
|-
| Wifi || 802.11b/g Atheros AR6014 || [http://www.db.pokestation.net/3DS/Wi-Fi%20module%20pinouts.pdf] || N/A
| Infrared IC || NXP S750 0803 TSD031C || ?? || ?? || ?? || NXP S750 1603 TSD438C
|-
|-
| Infrared IC || NXP infrared IC, "S750 0803 TSD031C" || [12] || [10]
| Custom Microcontroller || Renesas UC CTR || ?? || Renesas UC CTR 324KM47 KG10 || Renesas UC KTR || Renesas UC KTR 442KM13 TK14
|-
|-
| Auxiliary Microcontroller || Renesas Electronics UC CTR, custom Nintendo microcontroller || N/A || N/A
| PMIC? || TI 93045A4 OAAH86W || ?? || ?? || TI 93045A4 38A6TYW G2 || TI 93045A4 49AF3NW G2
|-
|-
| ? || "TI 93045A4 OAAH86W" || N/A || N/A
| Wifi SPI Flash
| Raw ID data: 20 58 || ? || ? || Raw ID data: 62 62 || ?
|}
|}
* [12] This IC is somewhat similar to [http://www.alldatasheet.net/datasheet-pdf/pdf/347838/NXP/SC16IS750IBS.html this].
* [12] This IC is somewhat similar to [http://www.alldatasheet.net/datasheet-pdf/pdf/347838/NXP/SC16IS750IBS.html this].
* The Raw ID data for Wifi SPI Flash is from command 0x9F, RDID.
== FCRAM ==
== FCRAM ==
== GPU ==
== GPU ==
Designed by Digital Media Professionals Inc. (DMP) and codenamed PICA 200, 268Mhz. Supports OpenGL ES 1.1.
Designed by Digital Media Professionals Inc. (DMP) and codenamed PICA200, 268Mhz.
Block diagram of an ULTRAY2000 based architecture PICA200:
[[File:Pica200BlockDiagram.png]]
[[File:Pica200BlockDiagram.png]]
PICA200 is compatible with OpenGL ES 1.1. It furthermore provides unique functionality for:
* Per-fragment lighting ("Lighting Maestro")
* Hard- and soft-shadowing ("Shadow Maestro")
* Polygon subdivision ("Figure Maestro")
* Bump mapping and procedural textures ("Mapping Maestro")
* Rendering of gaseous objects ("Particle Maestro")
Some parts of the extended functionality are provided in hardware by an extended geometry pipeline. Most importantly, PICA200 has three programmable vertex processors. There is furthermore a unit called [[GPU/Primitive_Engine|Primitive Engine]], which is a geometry shader unit (using the same instruction set as vertex shaders) with support for variable-size primitives. The Primitive Engine functionality may be disabled, and the geometry shader unit then acts as a fourth vertex processor. See [[Shader_Instruction_Set]] for more information on the shader instruction set.
[[GPU/Fragment Lighting|Fragment lighting]] is implemented as an optional pipeline step during pixel processing. It's implemented by having the vertex shader output an additional attribute describing the transformation (represented by a quaternion) to surface-local space. This per-vertex quaternion can then be interpolated across screen space to calculate dot products relevant for lighting (e.g. light vector dot normal vector). To provide support for advanced lighting models, these dot products are used as indices into programmable lookup tables. With this setup, PICA200 in particular supports the shading models Blinn-Phong, Cook-Terrance, Ward, and microfacet-based BRDF-models.
PICA200 supports four texture units, the fourth of which is used exclusively for [[GPU/Procedural Texture Generation|procedural texture generation]].
== SDIO controller ==
Nintendo recommends SD cards up to 32 GB however the internal SDIO controller seems to support SD cards up to 2.19 Terabyte (32-bit sector number). It's unknown if it really can handle that much. 128 GB was tested and works fine however it causes a major slowdown of the system especially at boot.
== Images ==
== Images ==
[[Image:2DSeMMC.jpg|500px]]
[[Image:2DSeMMC.jpg|500px]]
==== New 3DS ====
[[Image:N3DSeMMC.jpg]]
==== New 3DS XL ====
==== New 3DS XL ====
[[Image:N3DSXLeMMC.jpg]]
[[Image:N3DSXLeMMC.jpg]]
=== WiFi dongle pinout ===
=== WiFi dongle pinout ===
This is the interface for the 'NEW' WiFi module (based on Atheros AR6002) first included in DSi.
This is the interface for the 'NEW' WiFi module (based on Atheros AR6002) first included in DSi.
The proprietary and by now ancient DS-mode WiFi is colored yellow, pins are unknown.
The proprietary DS-mode WiFi is colored yellow, pins are unknown.
I²C eeprom is colored blue:
* SCL
* SCL
* SDA
* SDA
* NC
* NC
=== Auxiliary Microntroller ===
=== Auxiliary Microcontroller (MCU) ===
[[Image:CTR_UC.png|600px]]
[[Image:CTR_UC.png|600px]]
Monitors HOME button, WiFi switch, 3D slider, volume control slider.
Monitors HOME button, WiFi switch, 3D slider, volume control slider.
Controls LEDs, various power supplies.
Controls LEDs, various power supplies via an I²C connection to the PMIC.
Devices attached to I2C bus:
Two I²C buses are attached to the MCU. For one, the SoC is the master; for the other, the MCU is the master.
* UC (master?)
Devices attached to MCU master I²C bus:
* MCU (master)
* Fuel Gauge
* Accelerometer (slave address 0x18)
* Accelerometer (slave address 0x18)
* SoC (master? slave?)
* PMIC
* maybe more?
Devices attached to the SoC master I²C bus:
* SoC (master)
* MCU
* LCD
* Camera
* QTM (New3DS-only)
The MCU uses the [http://mcs.uwsuper.edu/sb/327/Resources/RL78.pdf RL78 ISA].
The MCU uses some custom Special Function Registers, but documentation for much of the hardware protocol/general SFRs can be found [http://courses.ee.sun.ac.za/Computer_Systems_245/Dokumentasie/RL78%20hardware%20manual%20(registers).pdf here].