Difference between revisions of "Hardware"

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There is one FCRAM(Fast Cycle RAM) in the 3DS.
 
There is one FCRAM(Fast Cycle RAM) in the 3DS.
 
== DESCRIPTION ==
 
== DESCRIPTION ==
The Fujitsu MB82M8080-07L chip internally contains 2 dies, branded MB81EDS516545 and MB82DBS08645. The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format.
+
The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645. The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format.
 
MB81EDS516545 is suited for consumer application requiring high data band width with low power consumption.
 
MB81EDS516545 is suited for consumer application requiring high data band width with low power consumption.
  

Revision as of 17:35, 22 October 2011

Specifications

According to iFixit.com (source):

Type Name Datasheet Source
SoC Nintendo 1048 0H (Custom): CPU, GPU & DSP all on one chip. N/A N/A
Processor Core ARM11 Multiprocessor Core 2x 268 MHz N/A [1]
GPU Digital Media Professionals Pica 268MHz N/A [2]
FCRAM 2x64MB Fujitsu MB82M8080-07L [3][4] [5] [6]
Storage Toshiba THGBM2G3P1FBAI8 1GB NAND Flash N/A N/A
Power Management Texas Instruments PAIC3010B 0AA37DW N/A FCC filing
Gyroscope Invensense ITG-3270 MEMS Gyroscope [7] --
Accelerometer ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH [8] --
Wifi 802.11b/g Atheros AR6014 [9] N/A
Infrared IC NXP infrared IC, "S750 0803 TSD031C" N/A [10]
Auxiliary Microcontroller UC CTR, custom Nintendo microcontroller N/A N/A

Datasheet for memory is for a chip in the same series, it has less memory than the one inside the 3DS (128mbits vs 512mbits).

There is a trove of data on the FCC website at [11].


FCRAM

There is one FCRAM(Fast Cycle RAM) in the 3DS.

DESCRIPTION

The Fujitsu MB82M8080-07L chip internally contains 2 dies, where each die is branded MB81EDS516545 and MB82DBS08645. The MB81EDS516545 die is a CMOS Fast Cycle Random Access Memory (FCRAM*) with Low Power Double Data Rate (LPDDR) SDRAM Interface containing 512MBit storage accessible in a 64-bit format. MB81EDS516545 is suited for consumer application requiring high data band width with low power consumption.

Images

Front

CTR Front.jpg

High Resolution

Back

CTR Back.jpg

High Resolution

NAND pinout

CTR NAND pinout.png

NAND dumping has been successful, but the image is encrypted.

WiFi dongle pinout

CTR WiFiDongle pinout.png

SDIO interface is colored red:

  • CLK
  • CMD
  • D0, D1, D2, D3

This is the interface for the 'NEW' WiFi module (based on Atheros AR6002) first included in DSi.

The proprietary and by now ancient DS-mode WiFi is colored yellow, pins are unknown.

I2C eeprom is colored blue:

  • SCL
  • SDA

SPI Flash is colored purple:

  • CLK
  • CS#
  • SI
  • SO
  • WP#
  • NC

Auxiliary Microntroller

CTR UC.png

Monitors HOME button, WiFi switch, 3D slider, volume control slider. Controls LEDs, various power supplies.

Devices attached to I2C bus:

  • UC (master?)
  • Accelerometer (slave address 0x18)
  • SoC (master? slave?)