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mLine 2:
Line 2: − According to iFixit.com ([http://www.ifixit.com/Teardown/Nintendo-3DS-Teardown/5029/1#s22696 source]): − + − + − + − + + + + + Line 19:
Line 22: − + − + − + − Datasheet for memory is for a chip in the same series, it has less memory than the one inside the 3DS (128mbits vs 512mbits).+ + + − There is a trove of data on the FCC website at [https://fjallfoss.fcc.gov/oetcf/eas/reports/ViewExhibitReport.cfm?mode=Exhibits&RequestTimeout=500&calledFromFrame=N&application_id=462292&fcc_id=%27EW4DWMW028%27].+ +
no edit summary
== Specifications ==
== Specifications ==
{| class="wikitable"
{| class="wikitable"
! Type !! Name !! Datasheet !! Source
! Type !! Name !! Datasheet !! Source
|-
|-
| SoC || Nintendo 1048 0H (Custom): CPU, GPU & DSP all on one chip. || N/A || N/A
| SoC || Nintendo 1048 0H (Custom): CPU, GPU, VRAM & DSP all on one chip. || N/A || N/A
|-
|-
| Processor Core || ARM11 Multiprocessor Core 2x 268 MHz || N/A ||[http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html]
| Processor Core || ARM11 MPCore 2x 268 MHz & 2x VFP Co-Processor || [http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0360f/index.html] || [11]
|-
|-
| GPU || Digital Media Professionals Pica 268MHz || N/A || [http://en.wikipedia.org/wiki/PICA200]
| GPU || [http://en.wikipedia.org/wiki/PICA200 DMP PICA] 268MHz || N/A || [11]
|-
|-
| FCRAM || 2x64MB Fujitsu MB82M8080-07L || [http://crediar.no-ip.com/sg_/download.php?id=d67d1c][http://edevice.fujitsu.com/fj/DATASHEET/e-ds/e511463.pdf] [http://edevice.fujitsu.com/jp/datasheet/j-ds/j511463.pdf]|| [http://www.ifixit.com/blog/blog/2011/03/28/nintendo-3ds-has-128mb-ram/]
| DSP || 134Mhz. 24ch 32728Hz sampling rates. || N/A || [11]
|-
| VRAM || 6 MB within SoC. Independent of system memory (FCRAM). || N/A || [11]
|-
| FCRAM || 2x64MB Fujitsu MB82M8080-07L ||[http://crediar.no-ip.com/sg_/download.php?id=d67d1c][http://edevice.fujitsu.com/fj/DATASHEET/e-ds/e511463.pdf][http://edevice.fujitsu.com/jp/datasheet/j-ds/j511463.pdf]|| [5]
|-
|-
| Storage || Toshiba THGBM2G3P1FBAI8 1GB NAND Flash || N/A || N/A
| Storage || Toshiba THGBM2G3P1FBAI8 1GB NAND Flash || N/A || N/A
| Power Management || Texas Instruments PAIC3010B 0AA37DW || N/A || FCC filing
| Power Management || Texas Instruments PAIC3010B 0AA37DW || N/A || FCC filing
|-
|-
| Gyroscope || Invensense ITG-3270 MEMS Gyroscope || [http://dl-web.dropbox.com/u/20520664/references/PS-ITG-3200-00-01.4.pdf] || --
| Gyroscope || Invensense ITG-3270 MEMS Gyroscope || [http://dl-web.dropbox.com/u/20520664/references/PS-ITG-3200-00-01.4.pdf] || N/A
|-
|-
| Accelerometer || ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH || [http://dl.dropbox.com/u/20520664/references/CD00213470.pdf] || --
| Accelerometer || ST Micro 2048 33DH X1MAQ Accelerometer Model LIS331DH || [http://dl.dropbox.com/u/20520664/references/CD00213470.pdf] || N/A
|-
|-
| Wifi || 802.11b/g Atheros AR6014 || [http://www.db.pokestation.net/3DS/Wi-Fi%20module%20pinouts.pdf] || N/A
| Wifi || 802.11b/g Atheros AR6014 || [http://www.db.pokestation.net/3DS/Wi-Fi%20module%20pinouts.pdf] || N/A
|-
|-
| Infrared IC || NXP infrared IC, "S750 0803 TSD031C" || N/A || [http://www.ifixit.com/Teardown/Nintendo-3DS-Teardown/5029/2#s22675]
| Infrared IC || NXP infrared IC, "S750 0803 TSD031C" || N/A || [10]
|-
|-
| Auxiliary Microcontroller || UC CTR, custom Nintendo microcontroller || N/A || N/A
| Auxiliary Microcontroller || UC CTR, custom Nintendo microcontroller || N/A || N/A
|}
|}
* [11] Official Documentation
* [5],[10] According to iFixit.com ([http://www.ifixit.com/Teardown/Nintendo-3DS-Teardown/5029/1#s22696 source]):
* Datasheet for memory is for a chip in the same series, it has less memory than the one inside the 3DS (128mbits vs 512mbits).
* There is a trove of data on the FCC website at [https://fjallfoss.fcc.gov/oetcf/eas/reports/ViewExhibitReport.cfm?mode=Exhibits&RequestTimeout=500&calledFromFrame=N&application_id=462292&fcc_id=%27EW4DWMW028%27].
== FCRAM ==
== FCRAM ==